Sony has offered a video teardown of the PS5, unveiling a huge fan – 120 mm in diameter and 45mm thick, to be specific – that can direct air to both sides of the motherboard. We didn’t know, yet, that Sony has plans to optimize the component based on its performance during individual games. During an interview with 4Gmaer. net, Yasuhiro Ootori told us how the console will monitor the temperature through a sensor inside the APU and three more attached to the mainboard. The highest value is then used to determine the speed of the fan.
The company will also be watching the APU and collecting data on individual games closely. “Various games will be released in the future, and data on the APU’s behavior in each game will be collected,” Otori said. “We have a plan to optimize the fan control based on this data.” According to 4Gamer.net, the console’s fan has a software-controlled maximum speed. But if the system is finding it difficult with a particular game, the speed could be increased further to improve cooling – even if it makes the fan run louder.
These currently-theoretical fan optimizations would presumably be delivered via software updates. PlayStation owners are used to firm patches that change or add new features to their system.
In the same interview, Otori addressed a few questions floating around the internet since Sony’s teardown video arrived. To begin with, he confirmed that the performance of the cooling system won’t be affected by the console’s orientation. Vertical, horizontal – your preference doesn’t matter, provided there’s enough space for the system to disperse heat.
TECH NEWS>>>>How To Choose The Right iPhone 12
